Part Number Hot Search : 
L24021IR MATCHED NET2890 LM2904LV SD4027 182S14E 63330 2SK1937
Product Description
Full Text Search
 

To Download HM117 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HM200101 Issued Date : 2001.07.30 Revised Date : 2004.12.21 Page No. : 1/5
HM117
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HM117 is designed for use in general purpose amplifier and low-speed switching applications.
SOT-89
Darlington Schematic
C
Absolute Maximum Ratings (TA=25C)
* Maximum Temperatures Storage Temperature ................................................................... -55 ~ +150 C Junction Temperature .......................................................... +150 C Maximum
B R1 R2 E
* Maximum Power Dissipation Total Power Dissipation (TA=25C) ................................................................................................................... 1.2 W Total Power Dissipation (Printed circuit board 2mm thick, collector plating 1cm2 square or larger) ....................................................... 1.6 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage...................................................................................................................... -100 V BVCEO Collector to Emitter Voltage................................................................................................................... -100 V BVEBO Emitter to Base Voltage............................................................................................................................. -5 V IC Collector Current (Continue) ............................................................................................................................ -4 A IC Collector Current (Peak) .................................................................................................................................. -6 A
Electrical Characteristics (TA=25C)
Symbol BVCBO BVCEO ICBO ICEO IEBO *VCE(sat) *VBE(on) *hFE1 *hFE2 Cob Min. -100 -100 1 500 Typ. Max. -1 -2 -2 -2.5 -2.8 200 pF Unit V V mA mA mA V V K IC=-1mA IC=-30mA VCB=-100V VCE=-50V VEB=-5V IC=-2A, IB=-8mA IC=-2A, VCE=-4V IC=-1A, VCE=-4V IC=-2A, VCE=-4V VCB=-10V, f=0.1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HM117
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
10000 100000
Spec. No. : HM200101 Issued Date : 2001.07.30 Revised Date : 2004.12.21 Page No. : 2/5
Saturation Voltage & Collector Current
hFE @ VCE=3V
Saturation Voltage (mV)
1000 hFE @ VCE=4V
10000
hFE
100
VCE(sat) @ IC=100IB 1000 VCE(sat) @ IC=250IB
10
1 1 10 100 1000 10000
100 100
1000
10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
10000 10000
On Voltage & Collector Current
Saturation Voltage (mV)
On Voltage (mV)
VBE(sat) @ IC=250IB
VBE(on) @ VCE=3V 1000 VBE(on) @ VCE=4V
1000
VBE(sat) @ IC=100IB
100 100
100 1000 10000 1 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Switching Time & Collector Current
10 VCC=30V, IC=250IB1=-250IB2
1000
Capacitance & Reverse-Biased Voltage
Switching Time (us)
Tstg 1 Tf
Capacitance (pF)
100
Cob
Ton
0.1 1 10
10 0.1 1 10 100
Collector Current (A)
Reverse-Biased Voltage (V)
HM117
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HM200101 Issued Date : 2001.07.30 Revised Date : 2004.12.21 Page No. : 3/5
Safe Operating Area
100000 PT=1ms 10000 PT=100ms
Collector Current-IC (mA)
1000
PT=1s
100
10
1 1 10 100 1000
Forward Voltage-VCE (V)
HM117
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
C H
Marking:
Date Code H117 Control Code Pb Free Mark
Pb-Free: " " (Note) Normal: None
Spec. No. : HM200101 Issued Date : 2001.07.30 Revised Date : 2004.12.21 Page No. : 4/5
B 1 E F G A 2 3
D
Note: Green label is used for pb-free packing
J
I
Pin Style: 1.Base 2.Collector 3.Emitter Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I
Min. 4.40 4.05 1.50 2.40 0.36 *1.50 *3.00 1.40 0.35
Max. 4.60 4.25 1.70 2.60 0.51 1.60 0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM117
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC's Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile
tP TP Ramp-up TL Tsmax Temperature tL
Spec. No. : HM200101 Issued Date : 2001.07.30 Revised Date : 2004.12.21 Page No. : 5/5
Critical Zone TL to TP
Tsmin tS Preheat
Ramp-down
25 t 25oC to Peak Time
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices.
Sn-Pb Eutectic Assembly <3 C/sec 100oC 150oC 60~120 sec <3oC/sec 183oC 60~150 sec 240 C +0/-5 C 10~30 sec <6oC/sec <6 minutes
o o o
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 sec <3oC/sec 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes
Peak temperature 245 C 5 C
o o
Dipping time 5sec 1sec 5sec 1sec
260 C +0/-5 C
o
o
HM117
HSMC Product Specification


▲Up To Search▲   

 
Price & Availability of HM117

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X